USA
- Akintunde I. Akinwande (Massachusetts Institute of Technology)
- Charles A. Spindt (MicroScience Engineering Laboratory, SRI)
- Charles E. Hunt (UC DAVIS)
- Chongwu Zhou (University of Southern California)
- Heinz Busta (Univ. of Illinois, Chicago)
- Hongie Dai (Stanford University)
- John A. Rogers (University of Illinois)
- Kevin L. Jensen (Naval Research Laboratory)
- Mark C. Hersam (Northwestern university)
- Niels de Jonge (Medical Center, Vanderbilt University)
- Otto Zhou (Univ. of North Carolina)
- P. R. Schwoebel (Univ. of New Mexico)
- Phaedon Avouris (Thomas J. Watson Research Center)
- Richard E. smalley (Rice University)
- Walt de Heer (University of California)
- Weng P. Kang (Vanderbilt University)
- Won Bong Choi (Florida International University)
- Zhenan Bao (Stanford university)
- Zhifeng Ren (Boston College)
Japan
- Hidenori Mimura (Research Institute of Electronics, Shizuoka University)
- Hiromichi Kataura (Advanced Industrial Science and Technology (AIST))
- Kenji Hata (Advanced Industrial Science and Technology (AIST))
- Koichi Hata (Electronic materials engineering laboratory, Mie University)
- Mikio TAKAI (Osaka University)
- Yahachi Saito (Saito Laboratory, Nagoya University)
- Yasuhito Gotoh (Laboratory of Beam Physics and Microprocessing, Kyoto Univ)
- Yoshinori Ando (Laboratory of Nano Materials, Meijo University)
- Yukio Hasegawa (The Institute for Solid State Physics, The University of Tokyo)
- Okuyama (Nagoya Institute of Technology)
- Masayuki Nakamoto (Research Institute of Electronics, Shizuoka University)
- Masahiro Sasaki (University of Tsukuba)
- Takatoshi Yamada (National Institute of Advanced Industrial Science and Technology (AIST))
- Takashi Mizutani (Nagoya University)
EU(UK)
- Richard G. Forbes (Surrey University )
- William I. Milne (Electrical Engineering Division, University of Cambridge)
- S. R. P. Silva (University of Surrey)
- Gehan A J Amaratunga (Department of Engineering, University of Cambridge)
EU(Germany)
- Günter Müller (Bergische Universität Wuppertal)
- Hans W. P. Koops (NaWoTec GmbH)
- R. Krupke (KIT – Institut für NanotechnologieGruppen)
EU(France)
- S.T. Purcell (laboratoire de physique de la matiere condensee et nanostructures, CNRS)
- Pierre Legagneux (Nanocarb Laboratory, Thales-Ecole Polytechnique)
EU(Finland)
China
- Ningsheng Xu (Sun Yat Sen Univ)
- Wei Fei (Center for Nano and Micro Mechanics, Tsinghua University)
- Wei Lei (Southeast Univ)
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